Aerosol Jet Printing of a Benzocyclobutene‐Based Ink as Adhesive Material for Wafer Bonding Application

Aerosol jet printing (AJP) is an emerging additive manufacturing technology that gaining increasing attention in the electronic field. Several studies have been carried out on AJP of conductive, semiconductive, and dielectric polymers for applications. However, wafer bonding application still uncovered by literature. Therefore, this work, benzocyclobutene (BCB) as a polymeric adhesive presented first time. A thorough characterization processing parameters to identify most ideal conditions at relatively high speed. Then, square patterns are printed, proving versatility terms reachable thickness deposited BCB patterns. Complex with resolution ≈60 µm also printed. The properties characterized from morphological mechanical point view. In particular, shear strength coatings ≈39 MPa it comparable coating spin-coating. Consequently, represents valid alternative deposition bonding.